JIC Leasing recently provided financial leasing services to a semiconductor technology company to support its advanced equipment procurement.

The integrated circuit industry represents the core of the information industry, a key force leading a new round of scientific and technological revolution and industrial change, and an important technical and industrial support for manufacturing in China. The integrated circuit industry chain includes upstream chip design, midstream wafer manufacturing, and downstream packaging and testing. The main business of this enterprise comprises high-end packaging and testing services for integrated circuits, which is one of the key links of the chip industry chain and falls under the 35 key cutthroat technologies in China.

The enterprise is a 2023 Forbes China Unicorn Semiconductor Enterprise, a National High-Tech Enterprise, and a Specialized, Refined, Differential and Innovative Enterprise in Jiangsu Province. It has mastered advanced packaging technologies, including Bumping, WLCSP (wafer-level chip packaging), QFN (Quad Flat No-leads Package), BGA (Ball Grid Array Package) and LGA (Land Grid Array Package) which are widely used in consumer electronics, industrial electronics and electronic vehicle fields. Compared with more traditional packaging forms, this advanced packaging offers the advantages of high integration, small size, short internal connection, strong systematization and high functional density, and adapts to the development trends of micro-miniature design, complexity and integration of integrated circuits.

JIC Leasing focuses on industrial core technology breakthroughs, provides financial support for the development of key products and technologies in the information technology industry, promotes scientific and technological innovation and advanced manufacturing, and offers proper "science and technology finance" services.